Applications such as BMS and PV systems require electronics that can withstand extreme thermal conditions. An improper approach to design and assembly processes may lead

Solder mask issues can account for up to 10–15% of PCB defects. Most common causes: ➡ Insufficient UV exposure or incorrect curing profile➡ Low-quality materials➡

Join us at TEK.day 2026! We warmly invite you to visit our stand No. 52 at the TEK.day Trade Fair, which will take place on

The selection of a PCB surface finish is very often made “by default” – without a deeper analysis of the application and project requirements. However,

We have launched THT selective soldering in a nitrogen atmosphere (N₂ 5.0 – 99.999%), expanding our process capabilities. This technology enables precise, localized soldering of

In PCB design, every detail matters — including the type of pads you use. Using BGA solder pads as an example, we compare two approaches:

During the SMT assembly process, it may happen that the PCB becomes warped after soldering the bottom side. This deformation can significantly hinder – or

In PCB manufacturing, the smallest details can make a huge difference. One effective way to prevent warping, twisting, or stress-related defects is by using non-functional

We wish you a peaceful Holiday Season and continued success in the coming New Year 2026. Thank you for your trust, collaboration, and partnership throughout

The quality of the stencil used for solder paste application has a surprisingly strong impact on the effectiveness of the SMT assembly process. It is

It is crucial to consider the manufacturer’s assembly recommendations already at the PCB design stage. These guidelines — available in component datasheets — often have

We warmly invite you to the Evertiq Expo, which will take place on October 23, 2025, at Warsaw’s PGE Narodowy Stadium. You can find us

In the electronics manufacturing process, precise product marking plays a key role in ensuring full traceability and quality control. With a proper marking system, each

MicroMELF and MiniMELF housings, despite their small size, are often chosen for their precision parameters and stability in harsh conditions. However, their specific characteristics –

Internal training is more than just passing on knowledge – it’s a powerful tool for building skills, fostering collaboration, and strengthening team spirit. Regular knowledge

Electronics production is a fast-moving environment – components change, design revisions happen, and test procedures evolve. That’s why keeping your documentation up to date is

What’s new at our facility? Definitely something that will streamline our daily warehouse operations!We’re excited to announce a new addition to our equipment lineup –

In our company, we control every stage of production, starting with the opening of the component packaging. This careful process allows us to ensure greater

We would like to invite you to TEK.day, which will be held on March 6 at Tarczynski Arena Wrocław. We look forward to seeing you

Soldering and repairing components in BGA packages is a challenge that requires precision and advanced equipment. Our new system for repairing and replacing BGA components

At our company, we take proactive measures to optimize solder paste stencils, ensuring precise application and reducing soldering issues: 1. Stencils Made of Fine-Grained Sheet

We have developed a method for fully securing modules against harsh external conditions prevalent in foundries and mines using non-combustible resins.

We would like to invite you to our stand #28. On October 24, 2024, the next edition of Evertiq Expo will be held in Warsaw

Sweden’s Biggest One Day Expo for the Electronics Industry! 19 September 2024, 09:00 – 16:00, Swedish Exhibition & Congress Centre. For You who work within

Discover 150+ subcontract and outsourced engineering services alongside a dynamic content programme.  Join interactive CPD-accredited workshops, product demonstrations, keynote presentations, roundtable discussions, and much more. Whether you are