Applications such as BMS and PV systems require electronics that can withstand extreme thermal conditions. An improper approach to design and assembly processes may lead to hidden issues that only become apparent during operation.
⚠️ Key challenges
➡ Operation under high thermal loads
➡ Risk of solder reflow during repeated heating cycles
➡ Component shifting and degradation of solder joints
✅ Proven solutions
➡ Use of solder pastes with antimony (Sb) content – increasing reflow peak temperature up to approx. 260 °C
➡ Optimization of the soldering profile for high-temperature environments
➡ Consideration of more demanding process requirements and EHS aspects
🚀 Long-term benefits
➡ Higher reliability in harsh environments
➡ Reduced risk of failures during operation
➡ In the long run – potential reduction of service and total manufacturing costs
💡 Conclusion:
Designing electronics for high-temperature operation is not only about component selection, but also about a conscious approach to the assembly process. It is essential to consider real operating conditions already at the DFM stage.
