Soldering voids presents technological challenge in achieving high-quality end products.
At our company, we have implemented effective strategies to minimize soldering defects:
– optimal layer of solder paste,
– solder paste from reliable suppliers,
– correct soldering profile in a reflow oven,
While IPC standards allow for up to 30% voids in solder, we hold ourselves to a higher standard. We accept no more than 20% defects in our manufacturing processes.
By prioritizing quality and longevity, we ensure that our produced devices meet the highest standards in the industry.
