During the SMT assembly process, it may happen that the PCB becomes warped after soldering the bottom side. This deformation can significantly hinder – or

In PCB manufacturing, the smallest details can make a huge difference. One effective way to prevent warping, twisting, or stress-related defects is by using non-functional

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The quality of the stencil used for solder paste application has a surprisingly strong impact on the effectiveness of the SMT assembly process. It is

It is crucial to consider the manufacturer’s assembly recommendations already at the PCB design stage. These guidelines — available in component datasheets — often have