Solder mask issues can account for up to 10–15% of PCB defects. Most common causes: ➡ Insufficient UV exposure or incorrect curing profile➡ Low-quality materials➡ Lack of validation for soldering…

Join us at TEK.day 2026!We warmly invite you to visit our stand No. 52 at the TEK.day Trade Fair, which will take place on 19 March 2026.At the stand, our…

The selection of a PCB surface finish is very often made “by default” – without a deeper analysis of the application and project requirements. However, this decision affects not only…

We have launched THT selective soldering in a nitrogen atmosphere (N₂ 5.0 – 99.999%), expanding our process capabilities. This technology enables precise, localized soldering of selected THT points without the…

In PCB design, every detail matters — including the type of pads you use. Using BGA solder pads as an example, we compare two approaches: SMD (Solder Mask Defined) and…

During the SMT assembly process, it may happen that the PCB becomes warped after soldering the bottom side. This deformation can significantly hinder – or even prevent – proper placement…

In PCB manufacturing, the smallest details can make a huge difference. One effective way to prevent warping, twisting, or stress-related defects is by using non-functional pads. When should you use…

We wish you a peaceful Holiday Season and continued success in the coming New Year 2026. Thank you for your trust, collaboration, and partnership throughout the year. We look forward…

The quality of the stencil used for solder paste application has a surprisingly strong impact on the effectiveness of the SMT assembly process. It is estimated that up to 60%…