THT
THT (Through-Hole Technology), also known as through-hole assembly, is a method of mounting electronic components on a printed circuit board – PCB. By placing the component leads through the holes in the board and soldering them on the opposite side. This differs from SMT assembly, where components are mounted directly onto the PCB surface. In THT assembly, the leads of components such as resistors, capacitors, diodes and integrated circuits are bent to fit into pre-drilled holes in the printed circuit board. Once inserted, the wires are soldered to copper pads on the opposite side of the board to create electrical connections. This process is usually performed manually or with automatic insertion machines.
THT installation has several advantages and is widely used in various areas:
- mechanical stability: through-hole components typically have stronger mechanical connections compared to surface-mounted components, making them more resistant to mechanical stress and vibration,
- power and Heat Handling: THT components are often used in high-power applications and devices that generate significant heat. Through connections provide improved thermal conductivity and electrical current carrying capacity,
- repair and conversion: THT assembly allows for easier repair and conversion of components. If a component needs to be replaced or repaired, it can be desoldered and replaced more easily than surface mount components,
- compatibility: THT components are compatible with older PCB designs that do not have surface mount pads, making them suitable for upgrading or repairing existing equipment.
THT assembly also has some limitations. It typically requires more space on the PCB due to component pinouts and holes, which limits board density and potentially increases the size of the overall device. Additionally, THT assembly is typically a slower and more labor-intensive process compared to SMT assembly, which can be automated for higher efficiency.
In summary, THT assembly is still widely used in a variety of industries and applications, especially in cases where mechanical strength, power or ease of repair are important factors.
SMT (vanaf 01005)
SMT (Surface-Mount Technology) is a surface mounting method and refers to the process of placing and soldering electronic components on the surface of a printed circuit board (PCB).
In SMT assembly, electronic components such as capacitors, resistors, integrated circuits and others are mounted directly on the surface of the printed circuit board. This method offers many advantages, including higher component density, smaller PCB size, improved electrical efficiency, and automated assembly processes.
The designation “01005” represents the component package size, which specifies the dimensions of the component in metric units. The size is marked as 0.01 inch by 0.05 inch (0.25 mm by 0.125 mm), making it one of the smallest surface mount packages available. These miniature components are difficult to move and position accurately due to their size, requiring specialized equipment and techniques during the assembly process. 01005 components are typically used in systems where size and weight are critical, such as medical devices, portable consumer electronics, and other compact electronic devices. As technology advances, smaller component sizes, including the 01005 package, allow the development of increasingly consistent and advanced electronic products.
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