THT
THT (Through-Hole Technology), also known as through-hole assembly, is a method of mounting electronic components on a printed circuit board (PCB). It involves inserting component leads through holes in the board and soldering them on the opposite side. This differs from SMT assembly, where components are mounted directly onto the surface of the PCB.
In THT assembly, the leads of components such as resistors, capacitors, diodes, and integrated circuits are formed to fit pre-drilled holes in the PCB. After insertion, the leads are soldered to copper pads on the opposite side of the board to create electrical connections. This process is typically performed manually or with the support of automated insertion equipment.
At ASZ Electronics Solutions, THT assembly can also be carried out in an automated way using selective wave soldering in a nitrogen (N₂) atmosphere. This technology enables precise, localized soldering of selected THT points without soldering the entire side of the PCB. It is particularly beneficial for mixed assembly (SMT + THT), double-sided boards, and high-density designs, where conventional wave soldering could expose SMT components to undesired heating. The use of nitrogen improves wettability, enhances solder joint cleanliness, and reduces oxidation — resulting in a stable and repeatable process.
THT assembly offers several advantages and is widely used in various applications:
mechanical strength: through-hole components typically provide stronger mechanical joints than surface-mount components, making them more resistant to mechanical stress and vibration,
power and thermal handling: THT components are often used in high-power applications and devices that generate significant heat. Through-hole joints provide better thermal conductivity and current-carrying capability,
repair and rework: THT assembly allows easier repair and rework. If a component needs to be replaced or repaired, it can generally be desoldered and swapped more easily than surface-mount components,
compatibility: THT components are compatible with legacy PCB designs that do not include surface-mount pads, making them suitable for upgrades or repairs of existing equipment.
THT assembly also has certain limitations. It typically requires more PCB area due to component leads and drilled holes, which limits board density and can increase the overall size of the device. In addition, THT assembly is usually slower and more labor-intensive compared to SMT, which can be highly automated for higher throughput.
In summary, THT assembly is still widely used across many industries and applications, especially where mechanical robustness, power handling, or ease of repair are key factors.
SMT (vanaf 01005)
SMT (Surface-Mount Technology) is a surface mounting method and refers to the process of placing and soldering electronic components on the surface of a printed circuit board (PCB).
In SMT assembly, electronic components such as capacitors, resistors, integrated circuits and others are mounted directly on the surface of the printed circuit board. This method offers many advantages, including higher component density, smaller PCB size, improved electrical efficiency, and automated assembly processes.
The designation “01005” represents the component package size, which specifies the dimensions of the component in metric units. The size is marked as 0.01 inch by 0.05 inch (0.25 mm by 0.125 mm), making it one of the smallest surface mount packages available. These miniature components are difficult to move and position accurately due to their size, requiring specialized equipment and techniques during the assembly process. 01005 components are typically used in systems where size and weight are critical, such as medical devices, portable consumer electronics, and other compact electronic devices. As technology advances, smaller component sizes, including the 01005 package, allow the development of increasingly consistent and advanced electronic products.
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