We have launched THT selective soldering in a nitrogen atmosphere (N₂ 5.0 – 99.999%), expanding our process capabilities.
This technology enables precise, localized soldering of selected THT points without the need for solder masks. The use of nitrogen improves wettability, enhances joint cleanliness, and reduces oxidation — resulting in a more stable, repeatable process.
Process benefits:
- reduced solder and flux consumption (up to 40%),
- minimal thermal impact on the PCB and components,
- reduced risk of typical defects and rework compared to conventional wave soldering,
- high repeatability and process stability.
This solution is particularly recommended for double-sided boards, high-density designs, and mixed assembly SMT + THT.
