Soldering and repairing components in BGA packages is a challenge that requires precision and advanced equipment.
Our new system for repairing and replacing BGA components enables the execution of even the most demanding repairs under fully controlled conditions.
Thanks to the ability to precisely set the temperature profile and visualize component positioning, the repair process becomes fast and effective.
We invest in innovation to deliver the highest quality of services and solutions.
Tips & Tricks #17 – PCB Warping After Soldering
During the SMT assembly process, it may happen that the PCB becomes
