CEM

To prepare an offer following aspects are needed for the documentation

1. A list of materials (BOM) that comprise of:

  • the type, value, resistance, the amount of the components, construction, label,
  • all relevant parameters for ordering components,
  • the preferred manufacturer,

2. Technical documentation containing PCBs:

  • Material
  • Width of the plate
  • Width of the copper
  • Surface coverage (Hal lead free, Hal tin lead and gold)
  • Description
  • Solder mask
  • Measurements

3. The documentation of PCB shall contain the following (Gerber files):

  • gto – Descriptive top layer
  • gts – Top layer of the Solder mask
  • GTL – Electrical top layer
  • gbo – Descriptive top layer
  • gbl – Electrical lower layer
  • gbs – Bottom layer of the Solder mask
  • GKO – Contour layer plates
  • gbp – Lower layer of the paste
  • GTP – Upper layer of the paste
  • drr – Drill